Infrastructure physical layer connection in data centre, LAN cabling backbone systems, backbone connectivity in building and campus.
Infrastructure physical layer connection in data centre, LAN cabling backbone systems, backbone connectivity in building and campus.
Comply with TIA/EIA 604-5, IEC 61754 series,Telcodia GR-1435-CORE Issue 2,Telcodia GR-326-CORE Issue 4 standards.
Fire resistance comply with low smoking (IEC 61304), halogen free (IEC 60754-1), flame retardant (IEC 60332- 3C), and corrosion proof (IEC 60754-2)
Fibre Count |
Fan-out Length (cm) |
Pulling Hook |
Bending Radius(mm) | Temperature (℃) |
Package |
||||
---|---|---|---|---|---|---|---|---|---|
Tenson(N) | Impact(N/cm) |
Static |
Dynamic |
Operation |
Installation |
Storage |
|||
12 |
60 - 100 |
400 |
100 |
400 |
20D |
-20 to +60 |
-5 to +50 |
-25 to +75 |
PE bag for
|
24 |
60 - 100 |
600 |
100 |
450 |
20D |
-20 to +60 |
-5 to +50 |
-25 to +75 |
|
48 |
60 - 100 |
600 |
100 |
450 |
20D |
-20 to +60 |
-5 to +50 |
-25 to +75 |
|
72 |
60 - 100 |
600 |
100 |
450 |
20D |
-20 to +60 |
-5 to +50 |
-25 to +75 |
|
96 |
60 - 100 |
600 |
100 |
450 |
20D |
-20 to +60 |
-5 to +50 |
-25 to +75 |
|
144 |
60 - 100 |
600 |
100 |
450 |
20D |
-20 to +60 |
-5 to +50 |
-25 to +75 |
Connector Type |
IL(dB) |
500times Durability ΔIL(dB) |
Temperature Cycling ΔIL(dB) |
---|---|---|---|
MPO/MTP MM Elite |
≤0.35 |
≤0.20 |
≤0.20 |
MPO/MTP SM Elite |
≤0.35 |
≤0.20 |
≤0.20 |
MPO/MTP MM standard |
≤0.70 |
≤0.20 |
≤0.20 |
MPO/MTP SM standard |
≤0.70 |
≤0.20 |
≤0.20 |
LC MM connector |
≤0.30 |
≤0.20 |
≤0.20 |
LC SM connector |
≤0.30 |
≤0.20 |
≤0.20 |
Fibre Type |
Core/Cladding Dia.(µm) |
Bandwidth(MHz·km) |
Wavelength(nm) |
Max. Attenuation(dB/km) |
---|---|---|---|---|
G652D |
9/125 |
NA |
1310/1550 |
0.36/0.22 |
G657A2 |
9/125 |
NA |
1310/1550 |
0.36/0.22 |
OM1 |
62.5/125 |
200 |
850/1300 |
3.0/1.0 |
OM2 |
50/125 |
500 |
850/1300 |
3.0/1.0 |
OM3 |
50/125 |
2000 |
850/1300 |
3.0/1.0 |
OM4 |
50/125 |
4700 |
850/1300 |
3.0/1.0 |